Develops liquid-metal ink metallization chemistries and process technologies to enable ultra-high-density interconnects (UHDI) for AI/high-performance computing chips, chiplet integration, and 3D die stacking with TSVs. Provides a PVD-in-a-Bottle alternative that integrates with existing infrastructure and enables circuits up to 250× denser than conventional PCBs for advanced RDLs and heterogeneous integration.